Sunday, December 12, 2021

Moore's law will live ... in 3D



Moore's Law will live ... in 3D as Intel's making the push to stack chips in the 3rd dimension to keep the law in place as fabbing's beginning to reach the limits of density due to the inevitable laws of physics and quantum.

Chip densities keep getting higher due to the shorter wave lengths used by steppers -  5/3/2nm - but the limit will eventually be reached, this is why Intel's take on chip design makes imminent sense.

refer to caption

A semi-log plot of transistor counts for microprocessors against dates of introduction, nearly doubling every two years.

The other significant development regarding chip design is the fact AI's building chips because the complexity of designing chips now exceeds the ability of man to build them. In combining AI to 3D fabbing, the compute power of systems will continue to increase without exception. 

Pundits have been proclaiming the death of Moore’s Law for many years. For the uninitiated, Moore’s Law is an observation made by Intel Co-Founder Gordon Moore, that says the number of transistors in an integrated circuit (IC) doubles approximately every two years. After about the third decade or so, every time I hear about the “death of Moore’s Law” at industry events, I (and about half of the other analysts and journalists in the room) roll our eyes. But the fact remains that Moore’s Law has plateaued, as chip makers strive for more advanced process nodes, while chip complexity has also increased exponentially.

The age of AI has arrived.

AI isn’t just a buzzword any longer. AI is being used everywhere from silly photo filters in phone apps, to recommendation engines, autonomous vehicles, big data analytics and advanced design automated design tools like DSO.ai. Specialized chips with dedicated AI processors reside almost everywhere including your smartphone, computers, and the in latest automotive tech. Now, the chip industry itself has reached a stage where AI is aiding in the design of these AI chips, and it is enabling engineering teams of all sizes to compete at the relentless pace required in the semiconductor industry.

Tech never sleeps ...

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